Skip to content

CURRENT_STATE.md

Latest commit

 

History

History
74 lines (54 loc) · 10.8 KB

CURRENT_STATE.md

File metadata and controls

74 lines (54 loc) · 10.8 KB
Raw

CoreLibrary — Current State (2026-07-10)

Snapshot at 227 components on master — verified green (typecheck · bun test 47 pass · validate --release --strict 227 OK · audit:3d 136 ok / 0 errors / 0 warnings · pack builds, opclib carries 168 MPN + 150 datasheet URLs). For the roadmap + deferrals see TODO.md; for how to continue see HANDOFF.md. Active roadmap: close 227 → 250–300 via external-sourced Wave C remainder, then P9 v1 release; plan at ~/.claude-personal/plans/act-as-pcb-engineer-drifting-jellyfish.md.

2026-07-10 (+58 → 227): NPTH boundary crossed (shared kicad-import 0.1.2 allowUnnumberedPads) — mounting holes M2–M4 + plated, fiducials, screw terminals, barrel jack, trimmer, buzzer (new audio), DHT11. KiCad breadth: headers 1x05–2x20 (RPi HAT), NTC, MOV, film cap, SIP-9 network, IR LED, phototransistor, 7-seg, slide switch. General-EE Wave C: USB-C 16P (no3d), bridges, relays (new relay), AP63203/XL4015 bucks, TP4056/MCP73831 chargers, battery holders (new battery), INA219/ACS712, SG-8002 osc (no3d), 32.768 kHz crystal, microSD, fuse holder, DRV8833, W5500, RJ45 magjack, LM386, PAM8403, LM4040, AD620, ADuM1201, A1301, ESP32-C3/S3, ATmega32U4, STM32G030F6. Orientation gate recalibrated (0 warnings); orientationHint/belowBoardBudgetMm/manifest transforms/existing:true refs added; opclib-pack 0.3.0 metadata (subcategory/datasheet/keywords) wired through pack → app; MPN backfill on 168 function parts; ams1117-3v3 moved ic→power (alias remap); subcategories normalized.

Wave A+B (2026-07-07, +44 → 169): TO-92 discretes (BC547/BC557/2N3904/2N3906/2N7000); diodes (1N4001/1N4004/SS16/SS24/SS26/BAT54C); op-amps (LM741/TL081/TL082/TL084/NE5534); LM35 + PC817; power discretes (TIP120/122/41C/42C, IRF3205, BD139/140); 78xx/79xx regs (L7812/09/15/7905/12); CD4000 (4011/4013/4017/4066); L293D + ULN2803A; CAN/RTC/ADC/DAC (MCP2515/2551, DS1307/DS3231, MCP3008/4725); 74HC244/245. New footprints: DIP-4, TO-126-3, DIP-18, SOIC-18W, SOIC-20W (DIP y-flips applied). Stopped at NPTH boundary — MountingHole/Fiducial/pot/barrel-jack/screw-terminals need the cross-repo @openpcb/kicad-import validateFootprintPads change (next step).

Inventory — 227 components / 223 symbols / 146 footprints / 136 3D (STEP-backed; 10 footprints no3d) — was 169

Per-category (2026-07-10): ic 69 · connector 36 · transistor 32 · power 22 · diode 20 · passive 13 · mechanical 9 · opto 7 · sensor 6 · crystal 5 · switch 3 · relay 2 · battery 2 · audio 1. Older 169-snapshot table below.

P0/P0.9/P1 = 23; P2–P6 sweep +57 → 80; W1/W2 waves +45 → 125 (manifests tools/manifests/p{2..6}-*.json, w1-*.json, w2-*.json; high-pin pinMaps via tools/gen-pinmap.ts).

Category (folder) N Representative parts
ic 40 MCUs (ATmega328P ×2, ATtiny85, STM32F103C8, RP2040); op-amps (TL072/074, MCP6002/6004, NE5532, RC4558, LM324/358); comparators (LM339/393); logic (74HC00/02/04/14/74/86/138/165/595, CD4051, PCF8574); interface (CH340C/G, MAX485, SP3485, TXB0108, MAX3232); timers (NE555, TLC555); memory (24LC256, W25Q32); ULN2003A; ESP32-WROOM-32; AMS1117-3.3
connector 23 pin-header 1x02..1x12 / 2x03/05/08, pin-socket ×4, JST-PH ×3, JST-XH ×3, USB-A, USB-Micro-B, IDC 2x05
transistor 20 BJT (BC817/847/807/857, MMBT2222A/3904/3906, SS8050/8550); MOSFET (2N7002, AO3400/3401, BSS138/84, Si2302, IRF540N, IRLZ44N); generics
diode 12 Schottky (1N5819, SS14, SS34); rectifier (1N4007, 1N5408); 1N4148, BAV99, BZX84, TVS, USBLC6-2SC6, generics
power 11 LDO (AMS1117-5.0/ADJ, AP2112K, ME6211, TLV1117); L7805, LM317; LM2596-ADJ; MT3608; TL431; DW01A
passive 7 resistor, capacitor (MLCC), inductor, ferrite-bead, electrolytic, tantalum, PTC fuse (parametric multi-footprint)
crystal 3 crystal 2-pin, crystal 4-pad (GND), ceramic resonator
opto 3 LED-SMD, LED-THT, WS2812B
sensor 3 BME280, DS18B20, LDR
switch 2 tactile-SMD, tactile-THT
mechanical 1 testpoint

Deferred parts + the no-STEP mechanical code path are tracked in TODO.md (Wave-2 + the long-lead-THT 3D-gate-calibration item).

Gates — all green (re-verified 2026-07-10 @227)

Check Command Result
Release validation bun tools/validate.ts --release --strict OK (227 comp)
3D orientation gate bun run audit:3d 136 ok / 0 errors / 0 warnings
Datasheet links bun tools/check-datasheet-links.ts active (curated URLs exist)
Tests bun test 47 pass
Typecheck bun run typecheck clean
Pack bun tools/pack.ts --version=0.0.0-dev .opclib built (227 comp)

The former 8 audit:3d false-positive warnings are resolved — the gate was recalibrated (up-axis vs cross-section, body-behind-pads budget, thin-standing waiver) and per-footprint orientationHint/belowBoardBudgetMm overrides cover DHT11/PS1240/18650.

What changed in P0/P1 (vs the spec's assumptions)

The expansion spec (../Corelibrary expansion plan.md) was written at an older commit / KiCad 9. Verified corrections now baked in:

  • Schema (schemas/component.schema.json): only 4 fields were actually new — datasheet, datasheetSource, keywords, subcategory. parameters + manufacturerParts were already present.
  • Importer (tools/import-kicad-batch.ts): now passes metadata through, auto-captures the KiCad Datasheet property (http-guarded) into datasheetSource, default --kicad-root fixed to ../references/kicad-libs, stamps upstreamCommit: c7e226a49.
  • Validator (tools/validate.ts): URI checks for datasheet fields (hard fail); soft notes (never fail under --strict) for empty parameters/keywords on ic/power/sensor.
  • KiCad libs: vendored at ../references/kicad-libs, KiCad 10.0.4 @ c7e226a49. Symbols are unpacked per-symbol files <Lib>.kicad_symdir/<Name>.kicad_sym. Transistors live in Transistor_BJT/Transistor_FET (NOT Device).
  • CI already runs --release --strict → every footprint must ship a STEP; parts without an upstream STEP are deferred to Wave 2 (see TODO).
  • Datasheets = link-only (decision): store a manufacturer URL in datasheet; no PDF hosting. Generics stay datasheet: null.

Cross-repo status

  • App supports builtin id remap via aliases[] — OpenPCB/src/modules/library/backend/sync/opclib-importer.ts → migrateLegacyAliases(). The 3 renamed ICs carry old ids in aliases[]; placed references migrate on import. No app change needed for the rename.
  • @openpcb/opclib-pack 0.3.0 (P7 DONE, 2026-07-10) carries subcategory/datasheet/keywords + maxEntries:8192; pack.ts passes them through (curated datasheet wins, falls back to datasheetSource). App wired: migration 0010_component_metadata.sql, importer maps metadata + seeds manufacturer/MPN from manufacturerParts[0], DetailsCard shows the real datasheet link. Shared tags opclib-pack-v0.3.0 + kicad-import-v0.1.2 are local-only until shared main+tags are pushed — push shared before consumers.
  • Per-instance Value editing works (PartInspectorPanel.tsx → update_part_properties) — parametric passives are fully usable.

Gotchas (read before re-importing — expanded during the P2–P6 sweep)

  • import-kicad-batch --allow-overwrite regenerates 3D sidecars from KiCad defaults, clobbering hand-tuned scaleMm.y:-1 orientation fixes (DIP/connector Y-flip). After any such re-import, run bun run audit:3d; if a model errors, re-apply scaleMm.y:-1 in its 3d/.../*.model.json. Avoid the dance entirely by using all-new asset ids for a phase (then no --allow-overwrite needed) — only reuse a shared id when the asset is genuinely shared (e.g. package.sot-23, package.to-92-inline).
  • audit:3d is a HARD release gate (0 errors required). Sweep findings: vertical pin headers/sockets, USB, THT switches need scaleMm.y:-1 (pin row mirrored into +Y); SMD parts seated <−0.1 mm need a small offsetMm.z (e.g. USB Micro-B +0.25); long-lead vertical THT (TO-220, DHT11, buzzer) currently TRIP the gate as false-positives and are deferred pending an orientation-gate.ts calibration (see TODO Wave-2).
  • --strict requires an explicit pinMap (it never auto-fills). For high-pin parts, generate identity maps from the footprint pad list — see the reusable generators scratchpad/gen-p4.ts / gen-p5.ts (read pads, emit {pinNumber:n, padNumber:n}; padOverride for non-electrical pads).
  • The importer follows extends recursively for pins → point symbol.path at the named child (e.g. MMBT3904, DS18B20); pins resolve from the parent.
  • Duplicate footprint NAME across two asset ids fails validate → reuse the existing shared footprint id (e.g. DS18B20 reuses package.to-92-inline) rather than minting a second asset for the same KiCad footprint.
  • Sharing a symbol id across components makes the importer name the shared symbol after the last component (name bleed) → give each part its own symbol id unless the symbol is genuinely shared.
  • Unnumbered/empty-number pads (DC barrel jack, potentiometer MP) are rejected by the strict importer → defer (Wave-2) or add non-electrical-pad handling.
  • Importer flags use --flag=value form, not space-separated.

Git

All work is on master (Wave A+B merged; 2026-07-10 session adds ~10 commits: cross-repo unblocks, gate recalibration, w1/w2/w3/wc waves, MPN backfill, cleanups). NOT pushed — push order: shared main+tags → CoreLibrary master → OpenPCB master. Working tree clean (only .graphifyignore untracked, pre-existing).